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How to Maximize Energy Storage in Low Temperature Electronics

Thursday June 27, 2019

2:00pm Eastern Standard Time

Agenda:

In aerospace and defense systems, electronic components are used in a wide range of subsystems including telemetry subsystems, structural subsystems, tracking subsystems, velocity control subsystems,  power distribution subsystems, and thermal control subsystems. Most of these applications subject electronic systems to large shocks, extreme vibrations, and hostile temperatures.  Components that are specially engineered to operate at low temperatures eliminate the need for specialized heating systems such as radioisotope heating units and allows use of simplified thermal management systems, helping to reduce the overall cost of building and deploying systems.

In this webinar, we'll discuss

  • The challenges of designing electronics for use in low temperature environments
  • How to reduce the complexity and cost of your low temperature electronic system
  • How to decrease weight and size in aerospace electronics
  • How to eliminate or reduce batteries from your design
  • An overview of ultracapacitors - how they're different and how they work
  • The importance of electrolyte chemistry in ultracapacitors
  • The benefits of a new ultracapacitor designed to withstand temperatures from -55C to 85C - (with minimal de-rating even at -55C)
  • Comparisons with the incumbent low temperature solutions
  • The Nanoramic FastCAP Low Temperature Ultracapacitor product overview, lifetime performance, and MTTF estimation

 

Speaker:

John Hyde 
Senior Chemical Engineer

John Hyde is a Senior Chemical Engineer at Nanoramic Labs, specializing in development of cell chemistries for unique applications and environments. He has been with Nanoramic for 4 years, focusing on electrolyte quality control and purity improvement.  Throughout his career at Nanoramic, his role has expanded to include electrochemical design and development with emphasis on electrode electrolyte interactions. John is the principle investigator and project lead for multiple cell and module development projects for customers ranging from memory backup to aerospace and defense industry contracts and he is a Senior Design Engineer on Nanoramic Chip Capacitor technology.  John has an MS Chemical Engineering from Northeastern University, and a BS in Chemical Engineering from Worcester Polytechnic Institute.

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