Join us on March 11th at 01:00 pm Eastern Time for our webinar: 8 Factors to Consider When Choosing Thermal Interface Materials.
The most commonly used methods for extracting heat from a high power CPU or a SOC (system on chip) are thermal paste or grease. While these solutions offer high performance, they come with disadvantages. They can be messy, time consuming, and can have poor long-term reliability. Additionally, conventional high conductive (>20W/mK) Thermal Interface Materials (TIMs) are known to have high cost as well as manufacturing difficulties and challenges. By using industry standard fabrication processes, Nanoramic Laboratories has developed a unique method to produce commercially available high conductive thermal interface material (TIM) pads which can be applied by industry users (such as heat sink companies) with surface mount equipment, for example, automatic pick and place equipment.
In this webinar, we will discuss:
Presenter: YongJoon Lee,
R&D Director of Polymer Composite Materials
Joon has extensive industry experience working on hands-on engineering and product development. Before he joined Nanoramic Laboratories as R&D Director -Polymer Composite Materials, he had over 10 years experience with a global manufacturer of thermal interface materials (TIMs), conductive plastics and EMI shielding products. He was a technical team leader for TIM product development and commercialization utilizing different resin chemistry, surface treatment, ceramic and metallic fillers and processing development.
He also had worked at several small innovation companies developing microelectronic packaging materials, nano composite optical materials and 3D printing materials.
Joon holds a Ph.D. in Materials Engineering Science from Virginia Tech. He graduate with B.S. and M.S in Chemical Technology from Seoul National University, Seoul Korea.
To join the webinar, please fill out this form below