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Latest Advances in Thermal Interface Materials for Consumer Electronics

Wednesday July 17, 2019

2:00pm Eastern Standard time


Thermal greases and pastes are the most commonly used methods for extracting heat from a high power CPU or a SOC (system on chip). While these solutions offer high performance, they can be messy, time consuming, and can have poor long-term reliability. Additionally, conventional high conductive Thermal Interface Materials (TIMs) utilizing carbon based fillers such as carbon nanotubes (CNTs), graphite, carbon fibers, and nanocarbons are known to have manufacturing difficulties and challenges.  By using industry standard fabrication processes, Nanoramic Laboratories has developed a unique method to produce commercially available high conductive thermal interface material (TIM) pads while lowering manufacturing costs. These naturally tacky TIM pads can be applied by industry users with surface mount equipment such as automatic pick-and-place machines.

Utilizing carbon-based fillers and elastomer-based resins, the soft TIM pads require very low compression force (below 10 psi) to achieve extremely low contact resistance like that of high-end thermal greases. The flexible TIM has thickness options from 0.25 to 5 mm, and a thermal conductivity of 20 W/mK.

In this webinar, CTO Nicolo Brambilla and R&D Director Yong Joon Lee will go over the following:

  • Overview of Current Thermal Management Solutions
  • Nanoramic High Performance Gap Filler
  • Comparative Results
  • Suggested Applications
  • Questions and Answers

The TIM pads have been validated using third-party testing and they outperformed other commercially available TIM pads as well as high-end thermal pastes. By using non-silicone based polymeric elastomers as a main matrix, Nanoramic has eliminated any silicone oil caused issues such as oil pumping out, drying out, or outgassing which may reduce TIM performance and harm other electronic components.  Also, our unique fully-reacted elastomer systems minimize TIM hardening or long term reliability issues upon thermal aging and thermal cycling. Nanoramic TIM pads can provide end users the flexibility of TIM choice without sacrificing performance and convenience.



Nicolo Brambilla
Chief Technology Officer

Nicolo Brambilla is an expert in energy storage and nanotechnologies, and holds the position of CTO at Nanoramic.  In 2010 he joined Nanoramic after working at Thales Avionics as a control engineer for aircraft avionics.

At Nanoramic, he led a team of engineers who developed the first - of – its - kind high temperature carbon nanotube ultracapacitor, that was successfully tested at Sandia National Labs. In 2013, his team successfully completed an ARPA - E program, meeting or exceeding all technical goals and developing a unique carbon based electrode with significant performance improvements over competitors. The resulting technology was validated at the NAVSEA Crane Laboratories and set world records for the highest energy density, the highest power density, and the highest frequency ultracapacitor, among others. Mr. Brambilla was Principal Investigator of NASA programs for the development of energy storage for extreme environments; he was also the Principal Investigator of a DoD program for high performance and long lifetime energy storage. He is lead author on numerous patents covering nano-materials for energy storage electrodes, electrolytes, and energy storage cells and modules.

Mr. Brambilla holds an M.Sc. in Electrical Engineering and an M.Sc. in Micro and Nanotechnologies from the École Supérieure d'Électricité, and an M.Sc. in Physics Engineering from Politecnico di Milano.


Yong Joon Lee
Director of R&D

Joon has extensive industry experience working on hands-on engineering and product development. Before he recently joined Nanoramic Laboratories as R&D Director -Polymer Composite Materials, he had over 10 years experience with a global manufacturer of thermal interface materials (TIMs), conductive plastics and EMI shielding products. He was a technical team leader for TIM product development and commercialization utilizing different resin chemistry, surface treatment, ceramic and metallic fillers and processing development.

He also had worked at several small innovation companies developing microelectronic packaging materials, nano composite optical materials and 3D printing materials.  

Joon holds a Ph.D. in Materials Engineering Science from Virginia Tech. He graduate with B.S. and M.S in Chemical Technology from Seoul National University, Seoul Korea.


Discussion topics for editing:

  • What are the major issues/pain points facing the industry right now?
    • People don't liek a silicone based material (such as thermal grease or thermal paste, even thermal pads) - have leakage or separation issues causing shorts on electronic components
      • Problems with non silicone system - alternatives are acrylic materials, urethane - but they are not high thermally stable
  • What industries are affected
    • Any electronics - Automotive, consumer electronics, high power electronics
  • How does our solution address these pain points?
    • High temperature resin and non silicone systems
    • Achieve high conductivity through proprietary fabrication methods using common fillers
    • Non reactive resin system - provides more consistent long-term results
  • What results can the end user expect?
    • High conductivity, high-end (higher than 10W/mk) thermal interface material for high power electronic applications
    • Easy pick and place solution 

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